●Producing Capability：
SMT pick and place chips more than 6 million point a day; AI DIP more than 2 million pieces a day; Three lines of manual placement; Two lines of testing; Two lines of assembly. These production lines can meet the machining and assembly of various kinds of home appliance, communication products, PC products.
● Technology Ability:
Our Pick and Place machine can assemble fine pitch chips such as 0201 size chip; Multi-functional machine can match 0.3 pitch packages such as QFP, BGA, uBGA, CSP and so on; DIP can match the assembly of standing and lying parts and jumper. To cater for the internationalization tendency, lead –free reflow solder machine and wave solder machine have been introduced to our company in 2000, meanwhile, we have put efforts on the research to the lead-free solder tin and reflow curve and wave flow. Now we have abundant practical experience on manufacture electronic products.
